Amkor Technology will break ground on new $2B packaging plant in Peoria in September

Key Points
Amkor Technology is set to begin construction in September on a new $2 billion semiconductor packaging facility in Peoria.
The facility, slated for completion by September 2034, will be the largest outsourced semiconductor packaging plant in the U.S., creating up to 2,000 jobs.
The groundbreaking ceremony is scheduled for Oct. 6, coinciding with the SEMICON West conference in Phoenix.

Amkor Technology (Nasdaq: AMKR)
David McCann | SVP, Chief of Staff, Arizona

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