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Dive Brief:
Amkor Technology has broken ground on a new semiconductor packaging and testing campus in Peoria, Arizona, the company announced Monday. Construction is expected to be finished in mid-2027, and production is slated to begin in early 2028.
The company expanded its total investment to $7 billion across two phases. The Arizona campus will include packaging and testing facilities along with 750,000 square feet of cleanroom space.
Amkor will collaborate with Taiwan Semiconductor Manufacturing Co. to supply chips to customers such as Apple and Nvidia.